Teardown Highlights

  • Apple Application Processor, 64bit Hexa-Core, 10nm FinFET, A11 Bionic
  • 64GB NAND and 3GB LPDDR4 SDRAM
  • Qualcomm Baseband Processor, MDM9655
  • 5.5" IPS LCD Display, In-Cell Touch w/3D Touch, 1920x1080

Preview this teardown in the IHS Teardown Tool

 

The Ultimate Competitive Benchmarking Tool

It’s imperative to make smart component cost and hardware design choices. Benchmarking tools like IHS Teardown solutions can help you balance device cost-effectiveness and feature-richness to satisfy the intended target market profitably.

The Teardown Analysis Service from IHS provides complete, detailed analysis of electronics, from small devices such as wireless handsets and tablets to larger equipment such as servers and automotive infotainment systems.  IHS Teardown solutions deliver a complete assessment of all electronic, electro-mechanical, and mechanical components.  

With over 13 years of teardown experience, more than 2500 teardowns, greater than 3M components identified and priced, over 90,000 teardown photos, and hundreds of research and technology analysts to back up the analysis of all component types, IHS Teardown solutions deliver the depth, breadth, and accuracy you need to make cost-effective tactical and strategic decisions.

If a picture is worth a thousand words, then IHS Teardown solutions provide the complete story. Simplify your search for answers.

 

Simple Search

Search for a type of device or for what’s “in” a device. See all thumbnail images as a preview of the teardown, without requiring a subscription.  Search for what is in a device or multiple devices by keywords such as manufacturer name, partial or full part numbers, markings, or any search term that matches information in a BOM line item.

Comparative Analysis

  • Compare multiple devices from a high-level specification view.
  • Compare photos of specific functions, PCB assemblies or features.
  • Compare detailed BOM line item component detail. Download complete BOMs, already merged together.

Interactive Analysis

View by tables, tabs, or pie charts to see the analysis the way you need to visualize it.

Downloads

The Downloads tab has all of the Excel BOMs, PDFs, and any additional assets for quick and easy access to a single device, or to compare multiple devices.

Breakout of Type of Teardowns from IHS 2300+ teardown database

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About IHS Teardowns

IHS's Teardown Service allows companies to perform a valuable and actionable combination of in-depth and strategic analysis. The information contained within this service allows comparisons to be made between similar devices in a given application group or across multiple applications. Specifically, IHS Technology’s spend analysts offer complete analysis, bill of materials (BOM cost), cost model, component pricing and component counts on all devices that are involved in a given teardown.

The device teardowns come from a variety of markets including cellular handsets, smartphones such as the iPhone teardown and Nexus One teardown, Set-Top Boxes, servers, routers, PCs, notebooks, netbooks, Mobile Internet Devices, digital cameras, PDAs and more. IHS Technology delivers a complete assessment of all electronic, electro-mechanical and mechanical components as well as the bill of materials (BOM costs), cost model, component pricing and teardown review.

Included in the teardown analysis are photo analysis, summary analysis, component cost tables and graphical representation, and a downloadable bill of materials Excel file. Teardown Tracks—Mobile Handsets, Data Communications & Computers, Personal & Home Electronics, and Tablets & eReaders—provide all devices within that market to the client with the ability to compare across devices and components. For example, the Mobile Handsets Teardown Track gives comparisons of the iPhone teardown and the Nexus One teardown side-by-side.

 
  Apple iPhone 8 Plus (A1864)
Product Link https://www.apple.com/iphone-8/
Battery
Capacity 2717 mAh
Type LiPolymer
Camera (Primary)
Flash Quad-LED
Resolution (Mpx) Dual 12(Telephoto) + 12(Wide Angle)
Camera (Secondary)
Resolution (Mpx) 7
Data
Bluetooth V5.0 + A2DP
NFC true
WLAN (Wi-Fi) a/b/g/n/ac
Display
Display Colors 16.7M
Height 1080 pixels
Pixel Density 401
Size 5.5 in
Type IPS LCD
Width 1920 pixels
Features
Cores Hexa Core
CPU 2x Monsoon & 4x Mistral
OS iOS 11.x
Sensors Accelerometer,Finger Print,Gyroscope,Proximity,Compass,Barometer
Input
Type In-Cell Touchscreen
Memory
Expansion Card None
Internal Storage 64 GB
RAM 3
Network
2G GSM 850,GSM 900,GSM 1900,GSM 1800
3G HSDPA 900,HSDPA 1700(AWS),HSDPA 850,HSDPA 1900,HSDPA 2100,CDMA2000 1xEV-DO,TD-SCDMA
4G LTE (2100 MHz) Band 1,LTE (1900 MHz) Band 2,LTE (1800 MHz) Band 3,LTE (1700 MHz) Band 4,LTE (850 MHz) Band 5,LTE (2600 MHz) Band 7,LTE (900 MHz) Band 8,LTE (700MHz) Band 12,LTE (700 MHz) Band 13,LTE (700 MHz) Band 17,LTE (800 MHz) Band 18,LTE (800 MHz) Band 19,LTE (800 MHz) Band 20,LTE (1900MHz) Band 25,LTE (850 MHz) Band 26,LTE (700 MHz) Band 28,LTE (700 MHz) Band 29,LTE (2300MHz) Band 30,LTE (2000 MHz) Band 34 TDD,LTE (2600 MHz) Band 38 TDD,LTE (1900 MHz) Band 39 TDD,LTE (2300 MHz) Band 40 TDD,LTE (2500 MHz) Band 41 TDD,LTE (1700 MHz) Band 66
Physical
Form Factor Bar
Ingress Protection IP67
Length 158.4 mm
Thickness 7.5 mm
Weight (g) 202.0 g
Width 78.1 mm
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Contact us to learn more about IHS Teardowns products and services.
About IHS Teardowns

IHS's Teardown Service allows companies to perform a valuable and actionable combination of in-depth and strategic analysis. The information contained within this service allows comparisons to be made between similar devices in a given application group or across multiple applications. Specifically, IHS Technology’s spend analysts offer complete analysis, bill of materials (BOM cost), cost model, component pricing and component counts on all devices that are involved in a given teardown.

The device teardowns come from a variety of markets including cellular handsets, smartphones such as the iPhone teardown and Nexus One teardown, Set-Top Boxes, servers, routers, PCs, notebooks, netbooks, Mobile Internet Devices, digital cameras, PDAs and more. IHS Technology delivers a complete assessment of all electronic, electro-mechanical and mechanical components as well as the bill of materials (BOM costs), cost model, component pricing and teardown review.

Included in the teardown analysis are photo analysis, summary analysis, component cost tables and graphical representation, and a downloadable bill of materials Excel file. Teardown Tracks—Mobile Handsets, Data Communications & Computers, Personal & Home Electronics, and Tablets & eReaders—provide all devices within that market to the client with the ability to compare across devices and components. For example, the Mobile Handsets Teardown Track gives comparisons of the iPhone teardown and the Nexus One teardown side-by-side.

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  • Device - Overview
  • Device - Overview
  • Device - Overview
  • Device - Overview
  • Device - Overview
  • Device - Overview
  • Box Contents - Literature & Packaging
  • Box Contents - Literature & Packaging
  • Box Contents - Accessories
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Other - Enclosures / Final Assembly - Enclosure, Main
  • Display / Touchscreen Module - Top
  • Display / Touchscreen Module - Module
  • Display / Touchscreen Module - Top
  • Display / Touchscreen Module - Top
  • Display / Touchscreen Module - Top
  • Display / Touchscreen Module - Top
  • Display / Touchscreen Module - Top
  • Main PCB - Top
  • Main PCB - Bottom
  • Primary Camera Module - Module
  • Primary Camera Module - Top
  • Primary Camera Module - Top
  • Primary Camera Module - Bottom
  • Primary Camera Module - Area
  • Primary Camera Module - Top
  • Primary Camera Module - Bottom
  • Primary Camera Module - Area
  • Secondary Camera Module - Module
  • Secondary Camera Module - Top
  • Secondary Camera Module - Top
  • Secondary Camera Module - Bottom
  • Secondary Camera Module - Area
  • Antenna PCB A - Top
  • Antenna PCB A - Bottom
  • Antenna PCB A - Area
  • Antenna PCB B - Top
  • Antenna PCB B - Bottom
  • Antenna PCB B - Area
  • Camera Flash / Control Button PCB - Top
  • Camera Flash / Control Button PCB - Bottom
  • Camera Flash / Control Button PCB - Area
  • Fingerprint Sensor Module - Module
  • Fingerprint Sensor Module - Top
  • Fingerprint Sensor Module - Bottom
  • Fingerprint Sensor Module - Area
  • Fingerprint Sensor Module - Top
  • Interface PCB - Top
  • Interface PCB - Bottom
  • Interface PCB - Area
  • Optical Sensor PCB - Top
  • Optical Sensor PCB - Bottom
  • Optical Sensor PCB - Area
  • Main PCB - Top
  • Main PCB - Bottom
  • Main PCB - Area
  • Main PCB - Top
  • Main PCB - Top
  • Main PCB - Top
  • Device - Overview
Clear
Clear
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Contact us to learn more about IHS Teardowns products and services.
About IHS Teardowns

IHS's Teardown Service allows companies to perform a valuable and actionable combination of in-depth and strategic analysis. The information contained within this service allows comparisons to be made between similar devices in a given application group or across multiple applications. Specifically, IHS Technology’s spend analysts offer complete analysis, bill of materials (BOM cost), cost model, component pricing and component counts on all devices that are involved in a given teardown.

The device teardowns come from a variety of markets including cellular handsets, smartphones such as the iPhone teardown and Nexus One teardown, Set-Top Boxes, servers, routers, PCs, notebooks, netbooks, Mobile Internet Devices, digital cameras, PDAs and more. IHS Technology delivers a complete assessment of all electronic, electro-mechanical and mechanical components as well as the bill of materials (BOM costs), cost model, component pricing and teardown review.

Included in the teardown analysis are photo analysis, summary analysis, component cost tables and graphical representation, and a downloadable bill of materials Excel file. Teardown Tracks—Mobile Handsets, Data Communications & Computers, Personal & Home Electronics, and Tablets & eReaders—provide all devices within that market to the client with the ability to compare across devices and components. For example, the Mobile Handsets Teardown Track gives comparisons of the iPhone teardown and the Nexus One teardown side-by-side.

A license is required to access this content. If you have a license, please login.
Learn More
Contact us to learn more about IHS Teardowns products and services.
About IHS Teardowns

IHS's Teardown Service allows companies to perform a valuable and actionable combination of in-depth and strategic analysis. The information contained within this service allows comparisons to be made between similar devices in a given application group or across multiple applications. Specifically, IHS Technology’s spend analysts offer complete analysis, bill of materials (BOM cost), cost model, component pricing and component counts on all devices that are involved in a given teardown.

The device teardowns come from a variety of markets including cellular handsets, smartphones such as the iPhone teardown and Nexus One teardown, Set-Top Boxes, servers, routers, PCs, notebooks, netbooks, Mobile Internet Devices, digital cameras, PDAs and more. IHS Technology delivers a complete assessment of all electronic, electro-mechanical and mechanical components as well as the bill of materials (BOM costs), cost model, component pricing and teardown review.

Included in the teardown analysis are photo analysis, summary analysis, component cost tables and graphical representation, and a downloadable bill of materials Excel file. Teardown Tracks—Mobile Handsets, Data Communications & Computers, Personal & Home Electronics, and Tablets & eReaders—provide all devices within that market to the client with the ability to compare across devices and components. For example, the Mobile Handsets Teardown Track gives comparisons of the iPhone teardown and the Nexus One teardown side-by-side.