Semiconductors & Components

Every facet of the semiconductor industry analyzed in detail, from raw materials and wafer fabrication through forecasts of end market consumption.


Analyst Insights View All (192)

Jérémie Bouchaud, Luca De Ambroggi, Richard Dixon, PhD | April 16, 2015
Texas Instruments has introduced an automotive grade version of its MEMS mirror array chipset for Head-Up Display (HUD) applications. TI claims its new DLP chipset enables head-up displays with a field of view of up to 12 °. The company also highlighted the brightness, color and contrast levels of its DLP3000-Q1 chipset, which is now sampling with automotive manufacturers and tier-one suppliers. The DLP 0.3-inch WVGA DMD will be offered in a Type A package, while the DLPC120 is available in a ZXS housing. ... See subscriber comment...
Jérémie Bouchaud, Richard Dixon, PhD | April 15, 2015
Colibrys chose April to announce a high performance MEMS gyroscope. The angular rate sensor is positioned to compete with Fiber Optical Gyroscopes (FOG) with a noise of 0.015 °/s (rms, 0.1 to 100Hz), a random walk rating of 0.005°/√h) and a short term stability –(Allan variance) of 0.2°/h. IHS comment: Colibrys is already the 2nd largest supplier of accelerometers for military and aerospace applications. Expanding its portfolio to include a high performance gyroscope was an obvious move and IHS believes that the Swiss MEMS company started internal development around 10 years ago as it was bidding for some publicly funded R&D projects to develop gyroscopes for aerospace.

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Reports View All (28)

  • Mike Howard, Clifford Leimbach, Dee Robinson | April 06, 2015
    Offers analysis of real-time cost and pricing, inquiries into overall market conditions, and insights into the impact and implication of trends on various end applications for DRAM.
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  • Michael Yang, Clifford Leimbach, Dee Robinson | March 19, 2015
    IHS surveys the major NAND applications to lay out expectations for the market.
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  • Marwan Boustany | January 26, 2015
    This report provides a unique Who-Sells-What-Sensor-to-Which OEM for the years 2010 to 2014, as well as examining emerging applications such as wearables and smart lighting. This report provides an unmatched granularity with market shares and forecasts pivot tables, allowing combined breakout by application, sensor function, integration type (discrete, combo, 2-in-1, 3-in-1…), and analog versus digital.
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Analysts View All (30)

  • Icon Vice President, Semiconductors & Components
    Dale Ford is a well-respected industry analyst with years of experience producing award winning market research. At IHS, Ford manages the research teams responsible for competitive analysis, forecasting, and supply/demand research of the electronics, semiconductor and electronics components industry.
  • Icon Senior Analyst, Automotive Technology
    Jeremy Carlson joined IHS in March of 2008 as a research analyst for current and future trends both in Italy and globally with a focus on safety and driver assistance technology.
  • Icon Senior Director, Semiconductor Manufacturing
    Len Jelinek has focused his research on capacity management and technology transitions within the semiconductor industry. He works with clients to access individual corporate strategies that may be impacted by additional wafer manufacturing capacity in China as well as other global locations.