Brandt Fifer

Brandt Fifer is a subject matter expert for IHS Technology where he primarily corresponds with clients as a concierge for the Strategic Support Services platform, guiding clients to IHS-enabled solutions and needs. He has also contributed to research and analysis on the subject of negotiation strategy and tactics within the mobile device value chain.

Prior to joining IHS, Brandt was an advisor focused on cost and product portfolio management at AT&T, where he was responsible for consumer device cost engineering, product selection intelligence and emerging device solution management. He developed AT&T’s first formal cost benchmarking and device negotiation program contributing to significant device cost savings for the company.

Additionally, Brandt was integral in establishing other competitive solutions within the Emerging Devices Organization, leading again to short-term competitive advantage over US carriers and laying the foundation for long-term continuity of such advantages. Focal areas included a variety of areas including M2M, Connected Car, Digital Life, mPERS, amongst others.

His background includes supply chain solution management, electronics cost intelligence, financial expertise within the telecom industry and beyond, consumer device subsidy and margin analysis, and enterprise risk management.

Prior to AT&T, Brandt also worked with Verizon Wireless and was an advisor and accounting professional at PricewaterhouseCoopers following his tenure at Arthur Andersen.

Brandt earned his Masters and Bachelor of Science degree in Accounting at Wake Forest University.

Specialty Areas

Research by Market

Contributions View All (6)

MediaTek Breaks into US LTE carrier market with Helio P10 in LG X Power for Sprint’s CDMA Network

On September 16th, 2016, MediaTek announced their first LTE smartphone win for the Sprint network in the US with the LG X Power model LS755. This design win on a major US carrier is significant in that it represents...

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Mobile, Consumer & Connected Devices Mobile & Telecom
Years in the Making, Intel modem chip finally returns to iPhone

After months, if not years, of whispers about a significant LTE thin modem design win, Intel’s 3rd generation XMM7360 CAT-9 modem was discovered inside certain models of the latest Apple iPhone 7 and 7 Plus. This was the first time since the iPhone 4 in 2010 that Intel (then Infineon) had a design win in the premier smartphone brand; back in a time when the iPhone was still a carrier exclusive device to AT&T.

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Teardowns & Cost Benchmarking Semiconductors Mobile & Telecom
Trade sanction ordeal likely to spur ZTE’s internal mobile chipset efforts

Two weeks after the US Commerce Department placed trade sanctions on ZTE over allegedly skirting US export controls laws (see US trade restrictions could be disastrous for ZTE’s smartphone business), a 3-month temporary lift of the sanction was put in place after “active” and “constructive” talks with the US government.

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Mobile, Consumer & Connected Devices Semiconductors Mobile & Telecom
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