Wayne Lam

Wayne Lam

Wayne Lam is principal analyst within the wireless communications team and is responsible for research related to the market tracking, forecast and supply chain analysis of mobilized devices.

Prior to joining the wireless group, Wayne served as a hardware analyst within the renowned IHS Teardown Services team, focusing on mobile handset designs. Wayne began his career as a process engineer at Intel Corp., starting with the 0.25um process technology through to the 300mm wafer manufacturing transition. He later took on the role of technical consultant at Symbian Inc., pioneering there in the smartphone operating systems space with leading handset OEMs.

More recently, Wayne has worked with firms like Qualcomm and Aerovironment in developing new business models and opportunities after graduating from business school. His research has been featured in various articles in major newspapers and magazines, such as The Wall Street Journal, Bloomberg/BusinessWeek, and The Economist.

Wayne graduated with an MBA from the Marshall School of Business at the University of Southern California (USC). He also earned two engineering degrees from Cornell University and the Massachusetts Institute of Technology (MIT).


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MWC 2019 Highlights - Smartphones

5G handsets arrived in Barcelona in force. Leading up to MWC, Samsung announced two 5G devices and Huawei one model. Other OEMs, like OPPO, Xiaomi, LG, ZTE and Nubia showed upcoming devices.

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Mobile, Consumer & Connected Devices Semiconductors Mobile & Telecom
Smartphone Electronics Design Intelligence Database

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Mobile, Consumer & Connected Devices Semiconductors Mobile & Telecom
Mobile World Congress 2019; A veritable parade of new 5G smartphones and modems

Mobile World Congress 2019 was anticipated to showcase brand new 5G smartphone designs and the conference did not disappoint. Even before the show officially started, there were 6 smartphone designs with 5G modems already announced:

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Mobile, Consumer & Connected Devices Semiconductors Mobile & Telecom
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