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Wayne Lam

Wayne Lam

Wayne Lam is principal analyst within the wireless communications team and is responsible for research related to the market tracking, forecast and supply chain analysis of mobilized devices.

Prior to joining the wireless group, Wayne served as a hardware analyst within the renowned IHS Teardown Services team, focusing on mobile handset designs. Wayne began his career as a process engineer at Intel Corp., starting with the 0.25um process technology through to the 300mm wafer manufacturing transition. He later took on the role of technical consultant at Symbian Inc., pioneering there in the smartphone operating systems space with leading handset OEMs.

More recently, Wayne has worked with firms like Qualcomm and Aerovironment in developing new business models and opportunities after graduating from business school. His research has been featured in various articles in major newspapers and magazines, such as The Wall Street Journal, Bloomberg/BusinessWeek, and The Economist.

Wayne graduated with an MBA from the Marshall School of Business at the University of Southern California (USC). He also earned two engineering degrees from Cornell University and the Massachusetts Institute of Technology (MIT).

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5G智能手机的市场反应能力在这一个新的无线技术的转型初期是前所未有的,与之前的4G LTE演进不同, 更多的手机厂商会第一时间将新设备提供给客户;不仅是关键的调制解调器套片与射频前端(RFEE)元器件在设计周期的早期阶段就可以提供给厂商, 还因为这些解决方案都是完整的“调制解调器到天线”设计,从而进一步加快初代5G智能手机投放市场的速度。 本文将进一步探寻射频技术与元器件如何支持5G设备,从而能在5G网络生命周期中尽早投放。作为IHS Markit Technology 对5G网络与设备性能“前瞻性研究”的一部分,我们评估的至少6部初代5G智能手机,并进行了彻底的拆解分析以确定5G无线核心元器件与系统设计。这批5G智能手机分别来自三星、LG、小米、Oppo、一加以及华为。

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Teardowns & Cost Benchmarking Semiconductors Mobile & Telecom
First-generation 5G designs highlight critical importance of modem and RF integration in future smartphones

• Physical disassembly performed on a batch of first-generation 5G smartphones from six different OEMs to uncover core 5G electronic and RF designs • Commonalities were identified from these initial 5G designs and characterized with simplified functional block diagrams • Information gleaned from existing 5G designs will help to inform on the direction of future 5G smartphones designs • In 5G, unlike in earlier wireless generations, modem and RF Front-End integrations are significantly more critical to the success of 5G devices

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Teardowns & Cost Benchmarking Semiconductors Mobile & Telecom
Smartphone Electronics Design Intelligence Database

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Mobile, Consumer & Connected Devices Semiconductors Mobile & Telecom
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