Teardown - Google Glass XE-C

July 28, 2014  | Subscribers Only

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Teardown Highlights

  • Difficult to assess true costs with production volumes so limited!

  • Non material NRE / development costs far outweigh 'component costs'

  • Many fixed costs (tooling/NRE), etc. can drive 'per unit' totals high

  • LCOS Panel confirmed from Himax based on markings

  • OMAP4430 - Have samples in our database

  • 45nm process on OMAP - not the most cutting edge

  • Many handsets now w/ 28nm core processors = lower pwr consumption

  • Most IC content used here are really circa 2011/2012 parts

  • Google Glass proof of concept phase using 'off-the-shelf' components

  • Premium materials used for fit and finish (box contents, titanium…)

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It’s imperative to make smart component cost and hardware design choices. Benchmarking tools like IHS Teardown solutions can help you balance device cost-effectiveness and feature-richness to satisfy the intended target market profitably.

The Teardown Analysis Service from IHS provides complete, detailed analysis of electronics, from small devices such as wireless handsets and tablets to larger equipment such as servers and automotive infotainment systems.  IHS Teardown solutions deliver a complete assessment of all electronic, electro-mechanical, and mechanical components.  

With over 13 years of teardown experience, more than 2500 teardowns, greater than 3M components identified and priced, over 90,000 teardown photos, and hundreds of research and technology analysts to back up the analysis of all component types, IHS Teardown solutions deliver the depth, breadth, and accuracy you need to make cost-effective tactical and strategic decisions.

If a picture is worth a thousand words, then IHS Teardown solutions provide the complete story. Simplify your search for answers.


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Search for a type of device or for what’s “in” a device. See all thumbnail images as a preview of the teardown, without requiring a subscription.  Search for what is in a device or multiple devices by keywords such as manufacturer name, partial or full part numbers, markings, or any search term that matches information in a BOM line item.

Comparative Analysis

  • Compare multiple devices from a high-level specification view.
  • Compare photos of specific functions, PCB assemblies or features.
  • Compare detailed BOM line item component detail. Download complete BOMs, already merged together.

Interactive Analysis

View by tables, tabs, or pie charts to see the analysis the way you need to visualize it.


The Downloads tab has all of the Excel BOMs, PDFs, and any additional assets for quick and easy access to a single device, or to compare multiple devices.

Breakout of Type of Teardowns from IHS 2300+ teardown database

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