Teardown - Google Glass XE-C

July 28, 2014  | Subscribers Only

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Teardown Highlights

  • Difficult to assess true costs with production volumes so limited!

  • Non material NRE / development costs far outweigh 'component costs'

  • Many fixed costs (tooling/NRE), etc. can drive 'per unit' totals high

  • LCOS Panel confirmed from Himax based on markings

  • OMAP4430 - Have samples in our database

  • 45nm process on OMAP - not the most cutting edge

  • Many handsets now w/ 28nm core processors = lower pwr consumption

  • Most IC content used here are really circa 2011/2012 parts

  • Google Glass proof of concept phase using 'off-the-shelf' components

  • Premium materials used for fit and finish (box contents, titanium…)

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The Ultimate Competitive Benchmarking Tool

It’s imperative to make smart component cost and hardware design choices. Benchmarking tools like IHS Teardown solutions can help you balance device cost-effectiveness and feature-richness to satisfy the intended target market profitably.

The Teardown Analysis Service from IHS provides complete, detailed analysis of electronics, from small devices such as wireless handsets and tablets to larger equipment such as servers and automotive infotainment systems.  IHS Teardown solutions deliver a complete assessment of all electronic, electro-mechanical, and mechanical components.  

With over 13 years of teardown experience, more than 2500 teardowns, greater than 3M components identified and priced, over 90,000 teardown photos, and hundreds of research and technology analysts to back up the analysis of all component types, IHS Teardown solutions deliver the depth, breadth, and accuracy you need to make cost-effective tactical and strategic decisions.

If a picture is worth a thousand words, then IHS Teardown solutions provide the complete story. Simplify your search for answers.

 

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Comparative Analysis

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Breakout of Type of Teardowns from IHS 2300+ teardown database

Research Area
Teardowns
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