Teardown Analysis - Apple iPad MC733LL/A (16GB / 3rd Generation / Wi_Fi + 4G - Verizon/AT&T) Tablet

The New Apple iPad MC733LL/A (Verizon + AT&T) Hardware Analysis

March 21, 2012  | Subscribers Only

Andrew Rassweiler Senior Principal Analyst, Teardown Services

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The new iPad, equipped with 32 Gigabytes (GB) of NAND flash memory and 4G Long Term Evolution (LTE) wireless capability, carries a bill of materials (BOM) of $364.35. When the $10.75 manufacturing costs are added in, the cost to produce the new iPad rises to $375.10. The BOM of the 16GB 4G LTE version amounts to $347.55, and the 64GB version is estimated at $397.95

Key Issues Addressed
  • How competitive are our designs from a technical perspective?
  • Where does our competition stand in terms of design sophistication?
  • Are our costs in line with those of our competitors?
  • How much does it cost our competitors to add certain product features?
  • How can we better position and differentiate our products?
  • What new or evolving solutions could we use in future designs that will increase performance and save money?
Applicable To
  • OEMs
    • Market Research Managers
    • Product Marketing Managers
    • Design / Technical Managers
    • Purchasing Management
  • Component Manufacturers
    • Product Marketing Managers
    • Market Research Managers
  • Service Providers
    • Purchasing Management
Deliverables
  • Summary Analysis
    • Commentary for Specific Assembly Levels
    • Component Cost Tables and Graphical Representation
    • Downloadable BOM Files
  • Photo Analysis¬†¬†
    • Block Diagrams / Functional Analysis
    • IC - Die Photos and Markings
    • Major Components
    • Sub-Assemblies

Andrew Rassweiler

Senior Principal Analyst, Teardown Services

Andrew Rassweiler manages the teardown service and also contributes as a principal analyst for teardowns. He has extensive knowledge on a variety of electronic devices and components, and provides a great deal of content and analysis in the teardown service...

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Organization
Apple
Research Area
Teardowns