Teardown Analysis - Apple iPhone 4S (16GB) Mobile Handset

Apple iPhone 4S (16GB) Mobile Handset Hardware Analysis

October 19, 2011  | Subscribers Only

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On the outside, the iPhone 4S may have disappointed some with its perceived lack of new features. But on the inside, the latest member of the iPhone line includes a wealth of innovation, including a new wireless module with a unique...

IHS iSuppli Teardown Analysis - Apple iPhone 4S

Key Issues Addressed
  • How competitive are our designs from a technical perspective?
  • Where does our competition stand in terms of design sophistication?
  • Are our costs in line with those of our competitors?
  • How much does it cost our competitors to add certain product features?
  • How can we better position and differentiate our products?
  • What new or evolving solutions could we use in future designs that will increase performance and save money?
Applicable To
  • OEMs
    • Market Research Managers
    • Product Marketing Managers
    • Design / Technical Managers
    • Purchasing Management
  • Component Manufacturers
    • Product Marketing Managers
    • Market Research Managers
  • Service Providers
    • Purchasing Management
Deliverables
  • Summary Analysis
    • Commentary for Specific Assembly Levels
    • Component Cost Tables and Graphical Representation
    • Downloadable BOM Files
  • Photo Analysis¬†¬†
    • Block Diagrams / Functional Analysis
    • IC - Die Photos and Markings
    • Major Components
    • Sub-Assemblies

Research Area
Teardowns